張蕓

張蕓博士是昕皓新材料的創始人和首席執行官。27年來，她一直活躍在新材料創新，研發和銷售領域， 并獲得業界全球技術獎三次，擁有26個專利及幾十篇論文。1994年，她入職AT&T貝爾實驗室, 從事基礎材料科學研究。在此期間，她用實驗手段第一次向外界展示了錫須成長的機理以及怎樣在電子應用中抑制其成長。2002年Cookson Electronics旗下的樂思化學聘請張博士任其全球電子材料研發總監。她對電鍍過程機理的理解加上對技術發展路線的認知使得她能更深層次的理解客戶的需求和痛點，龍頭電鍍設備商和客戶都很愿意與她合作。這種有效的合作成就了所有參與者。張博士在南京大學獲得化學學士學位，在布朗大學獲得化學博士學位。

Dr Yun Zhang, founder and CEO of Shinhao Materials LLC, has been active in materials innovation, R&D, marketing and sales for over 28 years, holding 28 granted patents, and numerous peer-reviewed journal publications and awards. She started her career at AT&T Bell labs in 1994, carrying out materials research and development.  Her work on tin whisker growth won international recognition for demonstrating experimentally for the first time its driving force and for developing mitigation solutions.  In 2002, she was appointed global R&D director by Cookson Electronics Enthone for its electronics business.  In the subsequent 10 years, her insight and leadership in fundamental understanding of electrodeposition process at a molecule level, combined with a deep appreciation of technology trends and customer needs has won Dr. Zhang many friends and willing partners at top tier equipment manufacturers and key customers.  Those close and collaborative partnerships resulted in win-win to all parties for RDL, copper pillar and TSV plating.  She received a BS in chemistry from Nanjing University, and a PhD in chemistry from Brown University.

演講題目：

此銅非彼銅也 - 晶粒結構的底層設計和實現

Presentation Topic: All Copper Is Not Created Equal – Grain Engineering in Electroplating

演講內容：

先進封裝正在經歷高速增長這也帶來了很多創新的機會。Heterogeneous integration的一些特殊要求對材料和制程提出了新的挑戰。在這個報告中，昕皓材料會用三個不同的銅制程來討論銅銅鍵合的要求，哪個制程更適合于銅銅鍵合的要求，以及客戶可以怎樣達到低溫鍵合并保證其它要求得到滿足。

The advanced packaging industry is undergoing rapid growth and ripe for innovation. New materials and processes are being considered to enable heterogeneous integration. In this paper, three different copper processes are discussed in the context of copper-to-copper hybrid bonding and other applications that could benefit from the new and different copper chemistries.